What is the cost of PCB Manufacture & Assembly for Bundalong?
Prices Start From $1000
Our PCB Manufacturing and PCB Assembly (PCBA) services offer small to large volume production. We also provide electronic design and prototyping services, if needed. Alternatively, just send us your gerber files, BOM, centroid (XY) data, board specs and quantity. Our engineers will work closely with you, to aim for the best quality and quickest possible lead time.
Cost-effective PCBA: low overheads, passing savings onto our customers.
Rapid PCBA: quotes back in about 48 hours.
Informative production: daily or weekly progress updates.
PCBA made easy - gotta love the power of stencils, reflow ovens, and pick & place robots.
We also offer Electronic Design, PCB Rework, and Software Development services for Bundalong, as part of our New Product Development suite of services.
PCB Capabilities
| Items | Manufacturing Capabilities | Remarks |
|---|---|---|
| Number of Layers | 1-10 layers | For orders above 10 layers, please contact us. |
| Material | FR-4, Aluminum | For Flex, Rigid-flex, Metal-based (Aluminum etc.), HDI, Halogen-free, High Tg, etc. - please contact us. |
| Maximum PCB Size (Dimension) | 500x1100 mm | Any sizes beyond this dimension - please contact us. |
| Board Size Tolerance (Outline) | ±0.2mm / ±0.5mm | ±0.2mm for CNC routing, and ±0.5mm for V-scoring. |
| Board Thickness | 0.4-2.4mm | 0.4, 0.6, 0.8, 1.0, 1.2, 1.6, 2.0, 2.4mm. Please contact us if your board exceeds these. |
| Board Thickness Tolerance (t ≥ 1.0mm) | ±10% | Normally "+ Tolerance" will occur due to PCB processing steps such as electroless copper, solder mask and other types of finish on the surface. |
| Board Thickness Tolerance (t < 1.0mm) | ±0.1mm | Normally "+ Tolerance" will occur due to PCB processing steps such as electroless copper, solder mask and other types of finish on the surface. |
| Min Trace | 0.1mm / 4mil | Min manufacturable trace is 4mil (0.1mm), strongly suggest to design trace above 6mil (0.15mm) to save cost. |
| Min Spacing | 0.1mm / 4mil | Min manufacturable spacing is 4mil (0.1mm), strongly suggest to design spacing above 6mil (0.15mm) to save cost. |
| Outer Layer Copper Thickness | 1oz / 2oz / 3oz (35μm / 70μm / 105μm) | Also known as copper weight. 35μm = 1oz, 70μm = 2oz, 105μm = 3oz. Please contact us if you need copper weight greater than 3oz. |
| Inner Layer Copper Thickness | 1oz / 1.5oz (35μm / 50μm) | Inner copper weight as per customer’s request for 4 and 6 layers. Please contact us if you need copper weight greater than 1.5oz. |
| Drill Sizes (CNC) | 0.2-6.3mm | Min drill size is 0.2mm, max drill is 6.3mm. Any holes greater than 6.3mm or smaller than 0.3mm will be subject to extra charges. |
| Min Width of Annular Ring | 0.15mm (6mil) | For pads with vias in the middle, Min width for Annular Ring is 0.15mm (6mil). |
| Finished Hole Diameter (CNC) | 0.2-6.2mm | The finished hole diameter will be smaller than size of drill bits because of copper plating in the hole barrels |
| Finished Hole Size Tolerance(CNC) | ±0.08mm | For example, if the drill size is 0.6mm, the finished hole diameter ranges from 0.52mm to 0.68mm will be considered acceptable. |
| Solder Mask | LPI | Liquid Photo-Imageable is the mostly adopted. Thermosetting Ink is used in the inexpensive paper-based boards. |
| Minimum Character Width (Legend) | 0.15mm | Characters of less than 0.15mm wide will be too narrow to be identifiable. |
| Minimum Character Height (Legend) | 0.8mm | Characters of less than 0.8mm high will be too small to be recognizable. |
| Character Width to Height Ratio (Legend) | 1:5 | In PCB silkscreen legends processing, 1:5 is the most suitable ratio |
| Minimum Diameter of Plated Half Holes | 0.6mm | Design Half-Holes greater than 0.6mm to ensure better connection between boards. |
| Surface Finishing | HASL with lead, HASL lead free, Immersion gold | The most popular three types of PCB surface finish. Please contact us for other finishes. |
| Solder Mask | Green, Red, Yellow, Blue, White, Black | No extra charge (Green, Red, Yellow, Blue) |
| Silkscreen | White, Black, None | No extra charge. |
| Panelization | V-scoring, Tab-routing, Tab-routing with Perforation (Stamp Holes) | Leave min clearance of 1.6mm between boards for break-routing. For V-score panelization, set the space between boards to be zero. |
| Others | Fly Probe Testing (Free) and A.O.I. testing(free), ISO 9001:2008, UL Certificate | No extra charge. |
A Local Hero in Bundalong, Victoria, Australia - COLETEK's Story
As a multidisciplinary Australian engineering and product development company established in 2001, COLETEK has earned a reputation for reliability, collaboration, and capability. We take pride in our national presence, serving businesses across Bundalong, Victoria, Australia, and throughout the country.
It's been over two decades since we first set out on our mission to innovate and improve lives through engineering and product development. Today, we're proud to count numerous prominent clients among our satisfied base, testimony to the trust and respect with which we operate. Our Bundalong, Victoria, Australia office is committed to providing unparalleled expertise to local businesses and organizations alike.
Innovative minds thrive when given the freedom to explore, experiment, and push boundaries. That's why at COLETEK, we foster an environment that encourages creative thinking and problem-solving. By joining forces with our clients in Bundalong, Victoria, Australia, and beyond, we leverage our collective expertise to drive meaningful change.
We don't just talk the talk; we walk the walk. Our team is comprised of dedicated professionals who are passionate about seeing projects through from conception to delivery. Whether it's a product redesign or an engineering solution for your unique challenge, rest assured that you're in good hands with COLETEK based in Bundalong, Victoria, Australia.
With our wealth of experience, cutting-edge technology, and unshakeable commitment to quality, we're uniquely equipped to support businesses across Bundalong, Victoria, Australia. That's why they choose us time and time again - knowing that we have the capability, adaptability, and local know-how to make their projects a resounding success.
Let’s build something remarkable together.
Contact UsPCB Manufacture & Assembly for Bundalong – Our Clients: Big Brands & Small Businesses
PCB Manufacture & Assembly for Bundalong – Amazing Customer Testimonials
COLETEK proved to be the perfect choice to help us kick our project off. Their analysis of the problem we presented with them with, and their suggestions for the most efficient and effective way to achieve a solution prevented us wasting time and money heading down the wrong path. I'd recommend COLETEK without any reservations.
COLETEK proved to be the perfect choice to help us kick our project off. Their analysis of the problem we presented with them with, and their suggestions for the most efficient and effective way to achieve a solution prevented us wasting time and money heading down the wrong path. I'd recommend COLETEK without any reservations.
As a leading technology solutions provider we carefully choose our partners to outsource some of our projects. Black Box has partnered with COLETEK in delivering numerous projects. Every single time they have delivered work of highest standard and meet our project deadlines. It's a pleasure to work with COLETEK team headed by Luke and hope to work on many more projects in the future.
Founded in 2001, we are a multiple award winning, highly experienced multidisciplinary company specialising in lean product development through rapid prototyping - transforming ideas from concept to life. Our industry-leading team combines deep expertise, cutting-edge technology, and advanced equipment to validate emerging ideas—transforming them into market-ready hardware and software solutions.
Our experience dates back to the 1990s with ANU "Robotics Systems Lab", CSIRO, NICTA (aka Data61), Seeing Machines, Location Aware Technologies, and Hemisphere GPS (aka BEELINE). For over 10 years now, we've been focused on validating R&D and taking ideas to commercialisation.
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